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Qualcomm Snapdragon 400 MSM8230AB poster

Generel Characteristics

Designer

Qualcomm

Type

Snapdragon 400 MSM8230AB

Codename

Snapdragon 400

Year Released

2013

Function

Multi-core Application Processor with Modem

Architecture

Width of Machine Word

32 bit

Supported Instruction Set(s)

ARMv7

Pipeline Stages

11 pipeline stages

Number of processor core(s)

2

Type of processor core(s)

2x Qualcomm Krait 300

Buses

Memory Interface(s)

mobile (LP) DDR2 SDRAM , mobile (LP) DDR3 SDRAM

Max. Clock Frequency of Memory IF

533 MHz

Data Bus Width

32 bit

Number of data bus channels

1 ch

Max. Data Rate

4.26 Gbyte/s

Non-volatile Memory Interface

eMMC 4.5

Clock Frequencies

Recommended Maximum Clock Frequency

1728 MHz max.

Cache Memories

L1 Instruction Cache per Core

16 Kbyte I-Cache

L1 Data Cache per Core

16 Kbyte D-Cache

Total L2 Cache

1024 Kbyte L2

Technology and Packaging

Feature Size

28 nm

Semiconductor Technology

CMOS

Fab

TSMC

Graphical Subsystem

Embedded GPU

Qualcomm Adreno 305 GPU

Cellular Communication

Supported Cellular Data Links

CSD 9.6 kbps , GPRS (Class unspecified) , EDGE (Class unspecified) , UMTS 384 kbps (W-CDMA) , HSUPA (Cat. unspecified) , HSDPA (Cat. unspecified) , TD-SCDMA data links

Satellite Navigation

Supported GPS protocol(s)

Yes

Supported GLONASS protocol(s)

Yes

Additional Information

Special Features

dual Qualcomm Krait 300 Harvard Superscalar cores, 533 MHz LP-DDR2 / LP-DDR3 SDRAM interface, Hexagon QDSP6V4 500MHz, GSM, GPRS, EDGE, UMTS, HSDPA, HSUPA, HSPA+, DC-HSPA+, TD-SCDMA baseband modem, dual SIM / dual standby support, 720p display support, 20 MP camera support, Adreno 305 GPU, 1080p video encode/decode, gpsOneGen 8A with GLONASS. Snapdragon 400 Processors are designed to deliver the performance, features, connectivity and battery life that consumers expect in high volume smartphones and tablets.

Disclaimer: DeviceBeast can not guarantee that the information on this page is 100% correct

Devices Using Qualcomm Snapdragon 400 MSM8230AB

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