HiSilicon Honor KIRIN970 Full Processor Specifications

HiSilicon

Honor KIRIN970

2017

Multi-core Application Processor with Modem

64 bit

ARMv8-A (A32, A64)

8

4x ARM Cortex-A73 + 4x ARM Cortex-A53 MPcore

mobile (LP) DDR4 SDRAM

1866 MHz

16 bit

4 ch

29.86 Gbyte/s

eMMC 5.1 , UFS 2.1

2360 MHz max.

64 Kbyte I-Cache

64 Kbyte D-Cache

2048 Kbyte L2

10 nm

CMOS

5500000000

TSMC

ARM Mali-G72 GPU

12-core GPU

767 MHz GPU

CSD 9.6 kbps , GPRS (Class unspecified) , GPRS Multi-slot Class 33 , EDGE (Class unspecified) , UMTS 384 kbps (W-CDMA) , HSUPA (Cat. unspecified) , HSUPA 5.76 Mbps (Cat. 6) , HSDPA (Cat. unspecified) , HSPA+ 42.2 Mbps (Cat. 20) , DC-HSDPA 42.2 Mbps (Cat. 24) , cdmaOne (IS-95) , CDMA2000 1xRTT (IS-2000) , CDMA2000 1xEV-DO Rel. 0 , CDMA2000 1xEV-DO Revision A , TD-SCDMA , TD-HSDPA , LTE (Cat. unspecified) , LTE 100 Mbps / 50 Mbps (Cat. 3) , LTE 150 Mbps / 50 Mbps (Cat. 4) , LTE 300 Mbps / 50 Mbps (Cat. 6) , LTE 300 Mbps / 100 Mbps (Cat. 7) , LTE 400 Mbps / 150 Mbps (LTE Cat. 13) , LTE 450 Mbps / 100 Mbps (LTE Cat. 10) , LTE 600 Mbps / 100 Mbps (LTE Cat. 12) , LTE 1 Gbps / 100 Mbps (LTE Cat. 16) , LTE 1.2 Gbps / 200 Mbps (LTE Cat. 18) data links

Yes

Yes

B1I BeiDou receiver

quad ARM Cortex-A73 (up to 2.4 GHz) + quad ARM Cortex-A53 (up to 1.84 GHz) Harvard Superscalar processor cores, ARM big.LITTLE, HMP, GSM / GPRS Class 33 / EDGE / CDMA / W-CDMA / HSPA+ 42.2 Mbps / HSUPA 5.76 / TD-SCDMA / LTE-TDD / LTE-FDD Cat. 18. baseband modem, Neural Network Processing Unit (NPU), i7 co-processor, Tensilica HiFi 4 DSP, dual SIM support (DSDA, DSDS), dual 42 MP 14-bit ISP, 2160p30 video encode, 2160p60 video decode, HDR10 support, USB 3.1, Bluetooth 5.0, OpenCL 2.0 FP, Vulkan 1.0, OpenGL ES 3.2, DirectX 12